Product

Industrial multi-network M2M SIM (Telefónica, Vodafone, Orange, MásMóvil)

Industrial-grade M2M SIM in 2FF/3FF/4FF, MFF2 (solderable chip), and eSIM formats. Certified for -40°C to +105°C, vibration, and humidity. Multi-network access across all four Spanish carriers (Telefónica, Vodafone, Orange, MásMóvil) and 190+ countries internationally. Built for PLCs, meters, EV chargers, solar inverters, and any industrial deployment requiring industrial-grade SIM hardware and unattended network failover.

Key features

Industrial grade

Designed to operate in extreme conditions: temperatures from -40°C to +105°C, vibrations and humidity.

Solderable MFF2 format

Embedded chip solderable directly to the PCB. No mechanical connectors that can fail.

High durability

Over 500,000 write cycles and data retention of more than 10 years.

Vibration resistant

Certified to withstand continuous vibrations in automotive and industrial applications.

Hermetic sealing

Protection against humidity, dust and corrosive agents. Ideal for outdoor and industrial use.

Extended lifecycle

Designed for long-term deployments without the need for replacement.

Technical specifications

FormatMFF2 (VQFN-8)
Dimensions5mm x 6mm x 0.9mm
Operating temperature-40°C to +105°C
Write cycles500,000+
Data retention10+ years
Vibration resistanceISO 16750
ProtectionIP68 (in design)
ESD8kV contact, 15kV air

Use cases

  • Automotive and connected vehicles
  • Industrial machinery and robots
  • Outdoor smart meters
  • Mining and construction equipment
  • Solar and wind energy systems
  • Precision agriculture and farm machinery
  • Transportation and logistics equipment
  • Smart city infrastructure

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Frequently asked questions

Does the industrial SIM support all four Spanish carriers in MFF2 (solderable) form?
Yes. The MFF2 (soldered chip) format accesses the same four Spanish networks — Telefónica, Vodafone, Orange and MásMóvil — as the removable formats (mini, micro, nano). Network selection is made by the modem based on coverage, not by the SIM form factor. For fixed deployments in rural areas we recommend verifying carrier-specific coverage before soldering.
What makes a SIM industrial vs consumer?
Three things: extended thermal range (-40 to +105 °C vs 0 to +70 °C), high write cycles (500,000+ vs ~100,000) and long data retention (10+ years vs 3-5). It also supports M2M profiles with optimized attach timers.
Why MFF2 instead of a removable 2FF/3FF/4FF SIM?
MFF2 is soldered directly to the PCB: no socket to fail under vibration, oxidation or corrosion, and the device stays sealed. Essential in automotive, outdoor and machinery with continuous vibration cycles. Comparison at /resources/comparisons/mff2-vs-2ff-removable.
Is there a removable version if I need to swap SIMs in the field?
Yes. The same IoT SIMs come in 2FF, 3FF, 4FF and MFF2 — you pick the form factor per part number. If your BoM is not closed yet, MFF2 is best for series production and 4FF for pre-series and field swaps.
Does it comply with ISO 16750 / AEC-Q?
The industrial MFF2 chip is certified for vibrations to ISO 16750 and we provide AEC-Q200 certifications when the project requires them (typical in automotive).
Does it still work outdoors with no enclosure?
Yes, within the thermal range. Physical sealing (humidity, dust) is the product enclosure's responsibility, not the SIM's — but MFF2 no longer has the exposed contacts of a removable SIM, which helps.
What technologies does it cover? LTE-M and NB-IoT?
2G, 3G, 4G LTE and 5G where the local operator supports them, plus LTE-M and NB-IoT where deployed. Useful because many industrial devices (meters, telemetry, agriculture) pick LPWAN over full 4G.
Is it compatible with eSIM/eUICC?
Yes, MFF2 is available both as a traditional SIM and as an eUICC eSIM with profiles swappable OTA. For new deployments with a compatible module we recommend eUICC + SGP.32.