Key features
PCB-solderable
6×5 mm MFF2 package compatible with standard SMT assembly. Removes the SIM holder and any tamper or physical-removal risk.
Industrial grade
Operates from -40°C to +105°C. Resistant to vibration, thermal shock and partial immersion (depending on enclosure IP rating).
Long service life
500,000+ write cycles and >10-year data retention. Designed for 7-10 year deployments with no physical maintenance.
Multi-carrier
Carrier profile is managed from the portal — if one carrier drops service, it switches to the next without a hardware redesign.
Global + permanent roaming
Coverage in 190+ countries with permanent roaming, supports 2G/3G/4G LTE, 5G, LTE-M and NB-IoT.
OEM-ready
Batch traceability, pre-allocated ICCIDs, assembly-line programming and direct technical support during homologation.
Technical specifications
Use cases
- Electricity, water and gas meters (smart metering)
- Outdoor industrial equipment (vibration, dust, humidity)
- Medical wearables and long-life trackers
- OEM serial devices with 7-10 year service life
- Flush-mounted EV chargers
- Agricultural sensors and remote solar PV sites
Frequently asked questions
- What exactly is MFF2 and why WLCSP?
- MFF2 is the chip-solderable form factor standardized by ETSI for embedded SIMs, a VQFN-8 package of 6 × 5 × 0.9 mm. WLCSP (Wafer Level Chip Scale Package) is the variant used in some modules for even denser integration. More at /resources/blog/diseno-hardware-mff2.
- Does it work with any cellular module?
- Yes, as long as the module or host PCB carries the MFF2 footprint. We validate it during onboarding against your BoM and provide reference Gerber files for standard SMT integration.
- Is there a difference between traditional MFF2 and eUICC MFF2?
- Physically the package is identical. The difference is functional: traditional MFF2 ships with a single profile burned in at the factory; MFF2 eUICC lets you download and switch profiles OTA via Remote SIM Provisioning. We recommend MFF2 eUICC for new designs.
- Can I reprogram the ICCID after soldering?
- The ICCID is fixed (it is the chip's unique identifier). What you can do on MFF2 eUICC is change the operator profile OTA. Administrative management (activation, suspension, plan change) happens from the portal or REST API without touching the device.
- How is it provisioned on the assembly line?
- We pre-allocate ICCIDs per batch, deliver a CSV with traceability and optionally ship the chip with the profile already loaded. Operational activation is triggered from your MES or from the portal when the device enters production.
- What packaging do you ship? Tape & reel or tray?
- Both available. Tape & reel is the standard for serial production with SMT feeders; tray for pre-series and prototyping. Confirmed at quote time per batch.
- Does it cover the same countries as the removable SIM?
- Yes. Same footprint: 190+ countries, 750+ networks, 2G/3G/4G/5G + LTE-M/NB-IoT where the local operator supports them.
Ready to get started?
Start with a test kit, or tell us about your project.